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When eutectic 63% tin – 37% lead solder is used, no lead-gold compounds are formed, because gold preferentially reacts with tin, forming the disperse in the solder matrix, forming preferential cleavage planes, significantly lowering the mechanical strength and therefore reliability of the resulting solder joints.

If the gold layer does not completely dissolve into the solder, then slow intermetallic reactions can proceed in the solid state as the tin and gold atoms cross-migrate.

At higher frequencies, the skin effect may cause higher losses due to higher electrical resistance of nickel; a nickel-plated trace can have its useful length shortened three times in the 1 GHz band in comparison with the non-plated one.

It also reduces the impact of pores present in the gold layer.

Intermetallics have poor electrical conductivity and low strength.

The ongoing intermetallic reactions also cause Kirkendall effect, leading to mechanical failure of the joint, similar to the degradation of gold-aluminium bonds known as purple plague.

Gold, applied by evaporated methods or electroplating, has been specified by NASA to thermally control spacecraft instruments, due to its 99% reflectivity in infrared wavelengths.

Gold plating is often used in electronics, to provide a corrosion-resistant electrically conductive layer on copper, typically in electrical connectors and printed circuit boards.